DTU (formerly DCE) holds an elite status among state universities with massive batch sizes that are successfully absorbed by top tech and consulting firms.
Google India's 2026 New Grad hiring has been narrower than 2023, and STEP / SWE-Intern conversion is now the more reliable path than direct campus. The SWE bar...
Microsoft SDE-1 2026 placement guide: online coding pattern, four-round virtual loop, As-Appropriate round playbook, Explore program details and salary bands cross-checked against verified candidate threads.
Amazon SDE-1 2026 placement guide: OA pattern, virtual loop structure, Bar Raiser preparation, Leadership Principles framework and solved coding questions cross-checked against verified candidate threads.
Apply for TCS NQT 2026 in 7 steps: official iON and NextStep portal links, Cycle 1 and Cycle 2 dates, eligibility, fee, document sizes, and slot booking.
Infosys 2026 aptitude practice: reported topic map for quantitative and logical reasoning plus 30 solved MCQs, an answer key, worked solutions, and a focused prep plan.
Elite is usually 60%/6.0, Turbo needs a higher 6.5-7.0 risk bar, and WILP uses pass 10th/12th plus 60%/6.0 graduation, with backlog rules by drive in 2026.
Accenture 2026 aptitude practice: reported cognitive-assessment topic map plus 30 solved MCQs across numerical, reasoning, and verbal, with answer key and worked solutions.
Track-wise Cognizant 2026 CGPA and percentage bar for GenC, GenC Pro and GenC Next, with 10th, 12th, UG and no-active-backlog rules for shortlist checks.
The average package at Delhi Technological University (DTU) for the recent placement season is roughly ₹15 - 17 LPA, depending on the engineering branch. Computer Science and IT branches typically see higher averages.
Top recruiters visiting the campus include Google, Microsoft, Amazon, TCS, Infosys, Wipro, Accenture, Cognizant and many other product and service-based companies.
Yes, DTU maintains an excellent placement record with approximately 90%+ of eligible students getting placed during campus drives.